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電路板-底部填充材料 FP4531 etc.

Redistribute stress away from the solder interconnects
● Enhance reliability and mechanical performance

詳細介紹

● Redistribute stress away from the solder interconnects

● Enhance reliability and mechanical performance
 

● 產品介紹

   LOCTITE ECCOBOND FP4531 30ML

   LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap

  •        Snap curable
  •        Fast flow
  •        Passes NASA outgassing

LOCTITE ECCOBOND FP4531 30ML TDS