產品分類 > 電子材料-Henkel
● Redistribute stress away from the solder interconnects
● Enhance reliability and mechanical performance
● 產品介紹
LOCTITE ECCOBOND FP4531 30ML
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap
● LOCTITE ECCOBOND FP4531 30ML TDS