● Redistribute stress away from the solder interconnects

● Enhance reliability and mechanical performance
 

● 產品介紹

   LOCTITE ECCOBOND FP4531 30ML

   LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap

•        Snap curable
•        Fast flow
•        Passes NASA outgassing

● LOCTITE ECCOBOND FP4531 30ML TDS